• Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Faster throughput and higher yields are achieved through excellent capillary action, faster flow characteristics and rapid cure speeds.

• Excellent Capillary Function for Fast Reflow Compatible with No-Clean Flux Residues 25%-35% Faster flow Reworkable at 120° C Good Storage Properties No Voiding .